CREAT BY ART

- Very low profile - typical height of 0.68mm

- Low power loss, high efficiency

- Ideal for automated placement

- Halogen-free according to IEC 61249-2-21 definition

Molding compound, UL flammability classification rating 94V-0

Packing code with suffix "G" means green compound (halogen-free)

Terminal:

Matte tin plated leads, solderable per JESD22-B102

Meet JESD 201 class 1A whisker test

SYMBOL

UNIT

V

A

pF

°C

°C

Document Number: DS_D1410055

Version: I14

Note 2: Measured at 1 MHz and Applied Reverse Voltage of 4.0 V D.C.

0.60

0.55

150

15

35

Typical junction capacitance (Note 2)

°C/W

Operating junction temperature range

-55 to +150

Storage temperature range

-55 to +150

Note 1: Pulse test with PW=300μs, 1% duty cycle

Typical thermal resistance

15

20

105

μA

mA

Maximum reverse current @ rated VR

Maximum instantaneous forward voltage (Note 1)

V

Maximum average forward rectified current

2

Peak forward surge current, 8.3 ms single half sine-wave

superimposed on rated load

25

A

Marking code

D

E

F

Maximum repetitive peak reverse voltage

20

30

40

Weight:

0.006 g (approximately)

PARAMETER

SS22M

SS23M

SS24M

MECHANICAL DATA

Case:

Micro SMA

Micro SMA

Polarity:

Indicated by cathode band

SS22M thru SS24M

Taiwan Semiconductor

Surface Mount Schottky Barrier

FEATURES

- Moisture sensitivity level: level 1, per J-STD-020

- Compliant to RoHS Directive 2011/65/EU and

in accordance to WEEE 2002/96/EC