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LTC1406IGN 데이터시트(PDF) 15 Page - Linear Technology |
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LTC1406IGN 데이터시트(HTML) 15 Page - Linear Technology |
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15 / 16 page ![]() 15 LTC1406 Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen- tation that the interconnection of its circuits as described herein will not infringe on existing patent rights. APPLICATIONS INFORMATION 0.337 – 0.344* (8.560 – 8.738) GN24 (SSOP) 1197 * DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE ** DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE 12 3 4 5 6 7 8 9 10 11 12 0.229 – 0.244 (5.817 – 6.198) 0.150 – 0.157** (3.810 – 3.988) 16 17 18 19 20 21 22 23 24 15 14 13 0.016 – 0.050 (0.406 – 1.270) 0.015 ± 0.004 (0.38 ± 0.10) × 45° 0 ° – 8° TYP 0.007 – 0.0098 (0.178 – 0.249) 0.053 – 0.068 (1.351 – 1.727) 0.008 – 0.012 (0.203 – 0.305) 0.004 – 0.0098 (0.102 – 0.249) 0.025 (0.635) BSC GN Package 24-Lead Plastic SSOP (Narrow 0.150) (LTC DWG # 05-08-1641) PACKAGE DESCRIPTION Dimensions in inches (millimeters) unless otherwise noted. Figure 12b. Suggested Evaluation Circuit Board—Component Side Silkscreen Figure 12c. Suggested Evaluation Circuit Board—Component Side Layout Figure 12d. Suggested Evaluation Circuit Board—Solder Side Layout |
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