LT3092

19

3092fb

DD Package

8-Lead Plastic DFN (3mm

× 3mm)

(Reference LTC DWG # 05-08-1698)

PACKAGE DESCRIPTION

ST Package

3-Lead Plastic SOT-223

(Reference LTC DWG # 05-08-1630)

3.00

±0.10

(4 SIDES)

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON TOP AND BOTTOM OF PACKAGE

NOTE:

1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

0.38

± 0.10

BOTTOM VIEW—EXPOSED PAD

1.65

± 0.10

(2 SIDES)

0.75

±0.05

R = 0.115

TYP

2.38

±0.10

(2 SIDES)

1

4

8

5

PIN 1

TOP MARK

(NOTE 6)

0.200 REF

0.00 – 0.05

(DD) DFN 1203

0.25

± 0.05

2.38

±0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

1.65

±0.05

(2 SIDES)

2.15

±0.05

0.50 BSC

0.675

±0.05

3.5

±0.05

PACKAGE

OUTLINE

0.25

± 0.05

0.50 BSC

.114 – .124

(2.90 – 3.15)

.248 – .264

(6.30 – 6.71)

.130 – .146

(3.30 – 3.71)

.264 – .287

(6.70 – 7.30)

.0905

(2.30)

BSC

.033 – .041

(0.84 – 1.04)

.181

(4.60)

BSC

.024 – .033

(0.60 – 0.84)

.071

(1.80)

MAX

10

MAX

.012

(0.31)

MIN

.0008 – .0040

(0.0203 – 0.1016)

10 – 16

.010 – .014

(0.25 – 0.36)

10 – 16

RECOMMENDED SOLDER PAD LAYOUT

ST3 (SOT-233) 0502

.129 MAX

.059 MAX

.059 MAX

.181 MAX

.039 MAX

.248 BSC

.090

BSC