TS5213 datasheet(3/8 Pages) TSC

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TS5213

Taiwan Semiconductor

Document Number: DS_P0000201

Version: G15

ELECTRICAL SPECIFICATIONS

(VIN = VO+1V, IO = 100μA, COUT = 1μF, Vce≥2V, TA = 25°C unless otherwise noted)

Enable Function

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNIT

Enable Input Logic-Low Voltage

Regulation shutdown

0.6

Enable Input Logic-High Voltage

Regulation enable

2.0

Enable Input Current

VIL≤ 0.6V

0.01

μA

VIH≥ 2.0V

Note:

Exceeding the absolute maximum rating may damage the device.

The maximum allowable power dissipation at any TA is PD(MAX) = [TJ(MAX) - Ta] + RθJA. Exceeding the maximum allowable

power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown.

Devices are ESD sensitive. Handling precautions recommended.

The device is not guaranteed to function outside its operating rating.

Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range.

Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load

regulation in the load range from 1mA to 80mA. Changes in output voltage due to heating effects are covered by the

thermal regulation specification.

Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value

measured at 1V differential.

Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the

supply is the sum of the load current plus the ground pin current.

Thermal regulation is defined as the change in output voltage at a time “t” after a change in power dissipation is applied,

excluding load or line regulation effects. Specifications are for a 80mA load pulse at VIH =16V for t=10ms.

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