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RF5365 데이터시트(PDF) 11 Page - RF Micro Devices

부품명 RF5365
상세설명  2.4GHz to 2.5GHz, 802.11b/g/n WiFi Front End Module
PDF  11 Pages
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제조업체  RFMD [RF Micro Devices]
홈페이지  http://www.rfmd.com
Logo RFMD - RF Micro Devices

RF5365 데이터시트(HTML) 11 Page - RF Micro Devices

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RF Micro Devices Inc.
7628 Thorndike Road, Greensboro, NC 27409-9421
DS140527
For sales or technical support, contact RFMD at +1.336.678.5570 or customerservice@rfmd.com.
The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of
third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended
application circuitry and specifications at any time without prior notice.
11 of 11
RF5365
Pin Names and Descriptions
Pin
Name
Description
1
RX OUT
Receive port for 802.11b/g/n band. Internally matched to 50
Ω. DC block required.
2
VREG
Regulated voltage for the PA bias control circuit. An external bypass capacitor may be needed on the VREG
line for decoupling purposes.
3
TX IN
RF input for the 802.11b/g/n PA. Input is matched to 50
Ω. DC block required.
4
VCC
Supply voltage for the FEM. Power down pin. Apply <0.6 VDC to power down the power amplifier stages. Apply
2.5 VDC to 3.6 VDC to power up. If function is not desired, pin may be connected to VCC or VREG.
5
VCC
Supply voltage for the FEM.
6
POWER DETECT
Power detector voltage for TX section. PDET voltage varies with output power. May need external decoupling.
7
ANT
Port matched to 50
Ω. DC block required.
8
GND
Ground connection.
9
BT PORT
Bluetooth® RF Port. DC block required.
10
C_RX
Control pin for WiFi Receive Port. Please see truth table for proper settings.
11
C_BT
Control pin for Bluetooth® Port. Please see truth table for proper settings.
12
C_TX
Control pin for WiFi Transmit Port. Please see truth table for proper settings.
Pkg Base
GND
Ground connection. The backside of the package should be connected to the ground plane through a short
path, i.e., PCB vias under the device are recommended.



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