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LTM4627 데이터시트(PDF) 21 Page - Linear Technology |
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LTM4627 데이터시트(HTML) 21 Page - Linear Technology |
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21 / 32 page ![]() LTM4627 21 4627fc For more information www.linear.com/LTM4627 Table 2. 1.2V Output DERATING CURVE VIN POWER LOSS CURVE AIRFLOW (LFM) HEAT SINK θJA (°C/W)* Figures 9, 11 5V, 12V Figure 7 0 None 13 Figures 9, 11 5V, 12V Figure 7 200 None 11 Figures 9, 11 5V, 12V Figure 7 400 None 8 Figures 10, 12 5V, 12V Figure 7 0 BGA Heat Sink 12 Figures 10, 12 5V, 12V Figure 7 200 BGA Heat Sink 8 Figures 10, 12 5V, 12V Figure 7 400 BGA Heat Sink 7 Table 3. 3.3V Output DERATING CURVE VIN POWER LOSS CURVE AIRFLOW (LFM) HEAT SINK θJA (°C/W)* Figures 13, 15 5V, 12V Figure 8 0 None 13 Figures 13, 15 5V, 12V Figure 8 200 None 11 Figures 13, 15 5V, 12V Figure 8 400 None 8 Figures 14, 16 5V, 12V Figure 8 0 BGA Heat Sink 12 Figures 14, 16 5V, 12V Figure 8 200 BGA Heat Sink 8 Figures 14, 16 5V, 12V Figure 8 400 BGA Heat Sink 7 * θJA derived from laboratory measurements using a 95mm × 76mm PCB with 4 layers. Two outer layers are 2oz copper and two inner layers are 1oz copper. PCB thickness is 1.6mm. BGA heat sink references are listed in Table 4. APPLICATIONS INFORMATION |
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