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RFCA1008

DS130627

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

support, contact RFMD at ((+1) 336-678-5570 or c

customerservice@rfmd.com.

Suggested Pad Layout

Pin Names and Descriptions

Pin

Name

Description

1RFIN

RF input pin. External DC-blocking capacitor is required.

2GND

Connection to ground. Use via holes for best performance to reduce lead inductance as close to ground

leads as possible.

3GND

Connection to ground. Use via holes for best performance to reduce lead inductance as close to ground

leads as possible.

4RFIN

RF input pin. External DC-blocking capacitor is required.

5RFOUT/VCC

RF output and bias pin (open collector).

6GND

Connection to ground. Use via holes for best performance to reduce lead inductance as close to ground

leads as possible.

7GND

Connection to ground. Use via holes for best performance to reduce lead inductance as close to ground

leads as possible.

8RFOUT/VCC

RF output and bias pin (open collector).

EPAD

GND

Exposed area on the bottom side of the package must be soldered to the ground plane of the board for

optimum thermal and RF performance. Several vias should be located under the EPAD as shown in the

recommended land pattern.