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DS111011

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.

SGL0263Z

Suggested Pad Layout

Package Drawing

Dimensions in inches (millimeters)

Refer to drawing posted at www.rfmd.com for tolerances.

Pin

Function

Description

1N/C

No electrical connection. Provide an isolated (ungrounded) solder pad for mounting integrity.

3RF IN

RF input pin. This pin requires the use of an external DC-blocking capacitor chosen for the frequency of operation.

4DC BIAS

Voltage supply connection. Bypass with suitable capacitors.

2, 5

GND

Connection to ground. Provide via holes as close to ground leads as possible to reduce ground inductance and achieve

optimum RF performance.

operation.

0.026

0.075

0.016

0.035

Notes:

1. Provide a ground pad area under device pins 2 & 5

with plated via holes to the PCB ground plane.

2. We recommend 1 or 2 ounce copper. Measure-

ments for this data sheet were made on a 31 mil

thick Getek with 1 ounce copper on both sides.