V2.00

Features

• High Isolation: 40 dB

• Low Current draw: < 2mA @ +5 V

< 10mA @ -5V

• 5V CMOS Logic

• 45mm PBGA Package

• JEDEC MO-151 Foot Print

PBGA Package Outline

4x6 RF Switch Matrix

4x6 RF Switch Matrix

4x6 RF Switch Matrix

4x6 RF Switch Matrix

800

800

800

800 ---- 900 MHz

900 MHz

900 MHz

900 MHz

SW-461

Description

M/A-COM’s SW-461 is a multi-chip module containing six

SP4T GaAs switches, each with a

driver/decoder and four

GaAs 6-way power dividers. The SW-461 utilizes Plastic Ball

Grid Array (PBGA) interconnect technology to achieve high

circuit density and superior high frequency performance. This

device is ideal for telephony applications in the AMPS

frequency bands.

The SW-461 is constructed with a multi layer PCB using a ball

grid array for the I/O connects.

The combination of several

state-of-the-art technologies achieves high performance at a low

cost.

Ordering Information

Part Number

Package

SW-461

45mm PBGA Package

Parameter

Test Conditions

Units

Min.

Typ.

Max.

Insertion Loss

800 - 900 MHz

dB

-11.5

-12

VSWR

800 - 900 MHz

1.5:1

1.9:1

Isolation

800 - 900 MHz

dB

42

57

Balance

800 - 900 MHz

dB

0.7

1.2

800 - 900 MHz

dBm

33

1.

All measurements in a 50

Ω system.

North America: Tel. (800) 366-2266, Fax (800) 618-8883

Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298

Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020

Specifications subject to change without notice.

Visit www.macom.com for additional data sheets and product information.

V 2.0