LP6253 datasheet(9/11 Pages) POWER

9 / 11 page

Preliminary Datasheet

LP6253

LP6253 –00

Version 1.0

Sep.-2013

Email: marketing@lowpowersemi.com

www.lowpowersemi.com

Page 9 of 11

placed close to the IC, is recommended .For a lower

output power requirement application, this value can

be decreased.

Output Capacitor Selection

For lower output voltage ripple, low-ESR ceramic

capacitors are recommended. The tantalum capacitors

can be used as well, but the ESR is bigger than

ceramic capacitor. The output voltage ripple consists

of two components: one is the pulsating output ripple

current flows through the ESR, and the other is the

capacitive ripple caused by charging and discharging.

The major parameter necessary to define the output

capacitor is the maximum allowed output voltage

ripple of the converter. This ripple is determined by

two parameters of the capacitor, the capacitance and

the ESR. It is possible to calculate the minimum

capacitance needed for the defined ripple, supposing

that the ESR is zero, by using Equation:

Layout Guideline

For high frequency switching power supplies, the

PCB layout is important step in system application

design. In order to let IC achieve good regulation,

high

efficiency

and

stability,

strongly

recommended the power components should be

placed as close as possible. The set races should be

wide and short. The feedback pin and then works of

feedback and compensation should keep away from

the power loops, and be shielded with a ground trace

or plane to prevent noise coupling.

Implementation of integrated circuits in low-profile

and fine-pitch surface-mount packages typically

requires special attention to power dissipation. Many

system-dependent issues such as thermal coupling,

airflow, added heat sinks and convection surfaces,

and

the

presence

other

heat-generating

components affect the power-dissipation limits of a

given

component.

Three

basic approaches

for

enhancing thermal performance are listed below:

Improving the power dissipation capability of the

PCB design;

Improving the thermal coupling of the component to

the PCB;

Introducing airflow in the system.

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