BAP65LX

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Product data sheet

Rev. 2 — 7 August 2013

2 of 9

NXP Semiconductors

BAP65LX

Silicon PIN diode

4.

Marking

[1]

For SOD882D binary marking code description, see Figure 1.

4.1 Binary marking code description

5.

Limiting values

6.

Thermal characteristics

Table 3.

Marking codes

Type number

Marking code[1]

BAP65LX

1001

0110

Fig 1.

SOD882D binary marking code description example

VENDOR CODE

MARKING CODE

(EXAMPLE)

CATHODE BAR

READING DIRECTION

READING DIRECTION

READING EXAMPLE:

0111

1011

006aac477

Table 4.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

reverse voltage

-

30

V

forward current

-

100

mA

total power dissipation

135

mW

storage temperature

65

+150

C

junction temperature

65

+150

C

Table 5.

Thermal characteristics

Symbol

Parameter

Conditions

Typ

Unit

thermal resistance from junction

to solder point

78

K/W