21

Customer Manufacturing Processes

This module is pluggable and is not designed for aqueous wash, IR reflow, or wave soldering processes.

Figure 8. SFP Assembly drawing.

41.78 ± 0.5

3.5 ± 0.3

1.7 ± 0.9

Tcase REFERENCE POINT

PCB

10 REF

(to PCB)

0.4 ± 0.1

(below PCB)

10.4 ± 0.1

15.25 ± 0.1

16.25 ± 0.1 MIN. PITCH

DIMENSIONS ARE IN MILLIMETERS

11.73 REF

CAGE ASSEMBLY

9.8 MAX.

15 MAX.