CYStech Electronics Corp.

Spec. No. : C769HT

Issued Date : 2014.04.29

Revised Date :

Page No. : 3/ 3

MB05ST08 thru MB10ST08

CYStek Product Specification

MBST Dimension

Marking :

Inches

Millimeters

Inches

Millimeters

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

0.165

0.181

4.200

4.600

F

-

0.008

-

0.200

B

0.023

0.031

0.600

0.800

G

-

0.275

-

7.000

C

0.177

0.193

4.500

4.900

J

0.006

0.010

0.150

0.250

D

0.049

0.057

1.250

1.450

L

-

0.650

-

1.650

E

0.900

0.106

2.300

2.700

Q

0.024

0.028

0.600

0.700

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material :

• Lead : Pure tin plated.

• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

MBST Plastic Surface

Mounted Package

CYStek Package Code: HT

XX

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Date Code

Device Name

Type

MB05ST08 MB1ST08 MB2ST08 MB4ST08 MB6ST08 MB8ST08 MT10ST08

Marking

05ST08

1ST08

2ST08

4ST08

6ST08

8ST08

10ST08