전자부품 데이터시트 검색엔진
  Korean  ▼
ALLDATASHEET.CO.KR

X  

TLV704 데이터시트(PDF) 13 Page - Texas Instruments

Click here to check the latest version.
부품명 TLV704
상세설명  TLV702 300-mA, Low-IQ, Low-Dropout Regulator
PDF  22 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
제조업체  TI [Texas Instruments]
홈페이지  http://www.ti.com
Logo TI - Texas Instruments

TLV704 데이터시트(HTML) 13 Page - Texas Instruments

Back Button TLV704 Datasheet HTML 9Page - Texas Instruments TLV704 Datasheet HTML 10Page - Texas Instruments TLV704 Datasheet HTML 11Page - Texas Instruments TLV704 Datasheet HTML 12Page - Texas Instruments TLV704 Datasheet HTML 13Page - Texas Instruments TLV704 Datasheet HTML 14Page - Texas Instruments TLV704 Datasheet HTML 15Page - Texas Instruments TLV704 Datasheet HTML 16Page - Texas Instruments TLV704 Datasheet HTML 17Page - Texas Instruments Next Button
Zoom Inzoom in Zoom Outzoom out
 13 / 22 page
background image
COUT
VOUT
VIN
GND PLANE
CIN
V
= 4.3 V
V
= 3.3 V
C
= 10 F
T = +25 C
IN
OUT
OUT
m
J
°
I
= 50 mA
OUT
I
= 1 mA
OUT
100
90
80
70
60
50
40
30
20
10
0
10
100
1 k
10 k
100 k
1 M
10 M
Frequency (Hz)
V
= 3.3 V
C
= 10 F
OUT
OUT
m
R = 66
L
W
V
IN
V
OUT
8
7
6
5
4
3
2
1
0
Time (2 ms/div)
TLV704
www.ti.com
SBVS148D – OCTOBER 2010 – REVISED JANUARY 2015
Typical Application (continued)
8.2.3 Application Curves
Figure 16. Power-Supply Ripple Rejection vs Frequency
Figure 17. Power Up/Power Down
9 Power Supply Recommendations
Connect a low output impedance power supply directly to the IN pin of the TLV704. Inductive impedances
between the input supply and the IN pin can create significant voltage excursions at the IN pin during start-up or
load transient events. If inductive impedances are unavoidable, use an input capacitor.
10 Layout
10.1 Layout Guidelines
Input and output capacitors should be placed as close to the device pins as possible. To avoid interference of
noise and ripple on the board, TI recommends designing the board with separate ground planes for VIN and
VOUT, with the ground plane connected only at the device GND pin. In addition, the ground connection for the
output capacitor should be connected directly to the device GND pin.
10.2 Layout Example
Figure 18. Layout Example for the DBV Package
Copyright © 2010–2015, Texas Instruments Incorporated
Submit Documentation Feedback
13
Product Folder Links: TLV704



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22


데이터시트 다운로드

Go To PDF Page


링크 URL



ALLDATASHEET 가 귀하에 도움이 되셨나요?  [ DONATE ] 

Alldatasheet는?   |   광고문의   |   운영자에게 연락하기   |   개인정보취급방침   |   링크 투 데이터시트    |   링크교환   |   제조사별 검색
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com