| 전자부품 데이터시트 검색엔진 |
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PLCC4XRGBCT 데이터시트(PDF) 7 Page - HB Electronic Components |
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PLCC4XRGBCT 데이터시트(HTML) 7 Page - HB Electronic Components |
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7 / 10 page ![]() Reflow Soldering Hand Soldering Profile Feature Lead Solder Lead-free Solder Temperature Soldering time 350 ℃ max. 3 seconds max. (one time only) Pre-heat temperature (Tsmin to Tsmax) 120~150 ℃ 180~200 ℃ Pre-heat time (Tsmin to Tsmax) 60-120 seconds 60-120 seconds Average ramp-up rate (Tsmax to Tp) 3 ℃/second max. 3 ℃/second max. Liquidous temperature (TL) 183 ℃ 217 ℃ Time at liquidous (TL) 60-150 seconds 60-150 seconds Peak package body temperature(Tp)* 235~240 ℃ max. 255~260 ℃ max. Classification temperature(Tc) 240 ℃ 260 ℃ Time(Tp)**within 5℃ of the specified classification temperature(Tc) 20**seconds 30**seconds Average ramp-dawn rate(Tp to Tsmax) 6 ℃/second max. 6 ℃/second max. Time 25 ℃ to peak temperature 6 minutes max. 8 minutes max. Note: 1. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. 2. ** Tolerance for time at peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. Technical Data Sheet Top View LED Hebei I.T. (Shanghai) Co., Lt Part No: PLCC4XRGBCT d. www.ledz.com Page 7 of 10 |
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