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Material Content Data Sheet

Sales Product Name

TLE7250VLE

Issued

28. September 2015

MA#

MA001335652

Package

PG-TSON-8-1

Weight*

27.05 mg

Construction Element

Material Group

Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip

inorganic material

silicon

7440-21-3

1.493

5.52

5.52

55184

55184

leadframe

inorganic material

phosphorus

7723-14-0

0.003

0.01

109

non noble metal

zinc

7440-66-6

0.012

0.04

436

non noble metal

iron

7439-89-6

0.236

0.87

8728

non noble metal

copper

7440-50-8

9.586

35.44

36.36

354409

363682

wire

non noble metal

copper

7440-50-8

0.035

0.13

0.13

1305

1305

encapsulation

organic material

carbon black

1333-86-4

0.029

0.11

1082

plastics

epoxy resin

-

1.507

5.57

55704

inorganic material

silicondioxide

60676-86-0

13.092

48.41

54.09

484034

540820

leadfinish

non noble metal

tin

7440-31-5

0.387

1.43

1.43

14307

14307

plating

noble metal

silver

7440-22-4

0.043

0.16

0.16

1607

1607

glue

plastics

epoxy resin

-

0.156

0.58

5774

noble metal

silver

7440-22-4

0.468

1.73

2.31

17321

23095

*deviation

< 10%

Sum in total:

100.00

1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.

Company

Infineon Technologies AG

Address

81726 München

Internet

www.infineon.com