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Material Content Data Sheet

Sales Product Name

TLE4963-2M

Issued

24. August 2015

MA#

MA001106126

Package

PG-SOT23-3-15

Weight*

9.78 mg

Construction Element

Material Group

Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip

inorganic material

silicon

7440-21-3

0.220

2.25

2.25

22463

22463

leadframe

inorganic material

silicon

7440-21-3

0.001

0.01

74

non noble metal

titanium

7440-32-6

0.004

0.04

369

non noble metal

chromium

7440-47-3

0.011

0.11

1106

non noble metal

copper

7440-50-8

3.590

36.72

36.88

367219

368768

wire

noble metal

gold

7440-57-5

0.023

0.24

0.24

2355

2355

encapsulation

organic material

carbon black

1333-86-4

0.055

0.56

5619

plastics

epoxy resin

-

1.181

12.08

120813

inorganic material

silicondioxide

60676-86-0

4.257

43.55

56.19

435491

561923

leadfinish

non noble metal

tin

7440-31-5

0.150

1.53

1.53

15308

15308

plating

noble metal

silver

7440-22-4

0.149

1.52

1.52

15200

15200

glue

plastics

epoxy resin

-

0.024

0.24

2447

noble metal

silver

7440-22-4

0.113

1.15

1.39

11536

13983

*deviation

< 10%

Sum in total:

100.00

1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.

Company

Infineon Technologies AG

Address

81726 München

Internet

www.infineon.com