MIC5270 datasheet(2/4 Pages) MICREL

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MIC5270

Micrel

MIC5270

284

March 1999

Absolute Maximum Ratings (Note 1)

Input Voltage (V

–IN) ....................................... –20V to +20V

Power Dissipation (P

D) ............................ Internally Limited

Junction Temperature (T

J) ....................... –40°C to +125°C

Lead Temperature (soldering, 5 sec.) ....................... 260

°C

Storage Temperature (T

S) ....................... –65°C to +150°C

ESD Rating, Note 3

Operating Ratings (Note 2)

Input Voltage (V

IN) .......................................... –16V to –2V

Junction Temperature (T

J) ....................... –40°C to +125°C

Thermal Resistance (

JA) ......................................... Note 4

Electrical Characteristics

IN = VOUT – 1.0V; COUT = 4.7µF, IOUT = 100µA; TJ = 25°C, bold values indicate –40°C ≤ TJ ≤ +125°C; unless noted.

Symbol

Parameter

Condition

Min

Typ

Max

Units

OUT

Output Voltage Accuracy

Variation from nominal V

OUT

–2

–3

∆V

OUT/∆T

Output Voltage Temperature

Note 5

100

ppm/

°C

Coefficient

∆V

OUT/VOUT

Line Regulation

IN = VOUT – 1V to –16V

0.055

0.15

%/V

∆V

OUT/VOUT

Load Regulation

OUT = 100µA to 100mA, Note 6

2.0

IN – VOUT

Dropout Voltage, Note 7

OUT = 100µA35

OUT = 10mA

250

OUT = 50mA

360

450

OUT = 100mA

480

600

GND

Ground Current, Note 8

OUT = 100µA70

µA

OUT = 10mA

250

µA

OUT = 50mA

0.7

OUT = 100mA

2.1

3.0

PSRR

Ripple Rejection

f = 120Hz

LIMIT

Current Limit

OUT = 0V

160

300

∆V

OUT/∆PD

Thermal Regulation

Note 9

0.05

%/W

Note 1.

Exceeding the absolute maximum rating may damage the device.

Note 2.

The device is not guaranteed to function outside its operating rating.

Note 3.

Devices are ESD sensitive. Handling precautions recommended.

Note 4.

The maximum allowable power dissipation is a function of the maximum junction temperature, T

J(max), the junction-to-ambient thermal

resistance,

JA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated using:

D(max) = (TJ(max) –TA) ÷ θJA, where θJA is 235°C/W. Exceeding the maximum allowable power dissipation will result in excessive die

temperature, and the regulator will go into thermal shutdown. See the “Thermal Considerations” section for details.

Note 5.

Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range.

Note 6.

Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load

range from 100

µA to 100mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification.

Note 7.

Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at 1V

differential.

Note 8.

Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the supply is the sum of

the load current plus the ground pin current.

Note 9.

Thermal regulation is defined as the change in output voltage at a time “t” after a change in power dissipation is applied, excluding load or line

regulation effects. Specifications are for a 100mA load pulse at V

IN = –16V for t = 10ms.

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