2001 Feb 05

7

NXP Semiconductors

Product specification

MMIC variable gain amplifier

BGA2031/1

ELECTRICAL BLOCK DIAGRAM

List of components (see Fig.10)

Note

1. The striplines are on a gold plated double copper-clad printed-circuit board (



copper thickness = 35

m, gold thickness = 5 m.

COMPONENT

DESCRIPTION

VALUE

DIMENSIONS

C1

multilayer ceramic chip capacitor

10 nF

0603

C2

multilayer ceramic chip capacitor

22 nF

0603

C3

multilayer ceramic chip capacitor

1.5 nF

0603

L1, L2

stripline; note 1

50



R1

SMD resistor

22

; 0.16 W

0603

R2

SMD resistor

2.4

; 0.16 W

0603

handbook, full pagewidth

MGU298

RF output

C1

R1

L1

L2

BIAS

CIRCUIT

RF input

VCTRL

DC-block

Bias-T

C2

VS1

VS2

C3

R2

Fig.10 Test diagram.