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PIC16C72-04/SP 데이터시트(PDF) 77 Page - Microchip Technology

부품명 PIC16C72-04/SP
상세설명  8-Bit CMOS Microcontrollers with A/D Converter
PDF  124 Pages
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제조업체  MICROCHIP [Microchip Technology]
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PIC16C72 Series
© 1998 Microchip Technology Inc.
Preliminary
DS39016A-page 77
13.0
ELECTRICAL CHARACTERISTICS - PIC16C72 SERIES
Absolute Maximum Ratings †
Parameter
PIC16C72
PIC16CR72
Ambient temperature under bias
-55 to +125˚C
-55 to +125˚C
Storage temperature
-65˚C to +150˚C
-65˚C to +150˚C
Voltage on any pin with respect to VSS (except VDD, MCLR, and RA4) -0.3V to (VDD + 0.3V)
-0.3V to (VDD + 0.3V)
Voltage on VDD with respect to VSS
-0.3 to +7.5V
TBD
Voltage on MCLR with respect to VSS (Note 1)
-0.3 to +14V
TBD
Voltage on RA4 with respect to Vss
-0.3 to +14V
TBD
Total power dissipation (Note 2)
1.0W
1.0W
Maximum current out of VSS pin
300 mA
300 mA
Maximum current into VDD pin
250 mA
250 mA
Input clamp current, IIK (VI < 0 or VI > VDD)
± 20 mA
± 20 mA
Output clamp current, IOK (VO < 0 or VO > VDD)
± 20 mA
± 20 mA
Maximum output current sunk by any I/O pin
25 mA
25 mA
Maximum output current sourced by any I/O pin
25 mA
25 mA
Maximum current sunk by PORTA and PORTB (combined)
200 mA
200 mA
Maximum current sourced by PORTA and PORTB (combined)
200 mA
200 mA
Maximum current sunk by PORTC
200 mA
200 mA
Maximum current sourced by PORTC
200 mA
200 mA
1.
Voltage spikes below VSS at the MCLR pin, inducing currents greater than 80 mA, may cause latch-up. Thus,
a series resistor of 50-100
Ω should be used when applying a “low” level to the MCLR pin rather than pulling this
pin directly to VSS.
2.
Power dissipation is calculated as follows: Pdis = VDD x {IDD -
∑ IOH} + ∑ {(VDD - VOH) x IOH} + ∑(VOl x IOL).
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation list-
ings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.



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