| 전자부품 데이터시트 검색엔진 |
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PIC876 데이터시트(PDF) 196 Page - Microchip Technology |
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PIC876 데이터시트(HTML) 196 Page - Microchip Technology |
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196 / 218 page ![]() PIC16F87X DS30292C-page 194 2001 Microchip Technology Inc. 44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP) * Controlling Parameter Notes: Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-026 Drawing No. C04-076 1.14 0.89 0.64 .045 .035 .025 CH Pin 1 Corner Chamfer 1.00 .039 (F) Footprint (Reference) (F) A A1 A2 α E E1 #leads=n1 p B D1 D n 1 2 φ c β L Units INCHES MILLIMETERS* Dimension Limits MIN NOM MAX MIN NOM MAX Number of Pins n 44 44 Pitch p .031 0.80 Overall Height A .039 .043 .047 1.00 1.10 1.20 Molded Package Thickness A2 .037 .039 .041 0.95 1.00 1.05 Standoff § A1 .002 .004 .006 0.05 0.10 0.15 Foot Length L .018 .024 .030 0.45 0.60 0.75 Foot Angle φ 03.5 7 0 3.5 7 Overall Width E .463 .472 .482 11.75 12.00 12.25 Overall Length D .463 .472 .482 11.75 12.00 12.25 Molded Package Width E1 .390 .394 .398 9.90 10.00 10.10 Molded Package Length D1 .390 .394 .398 9.90 10.00 10.10 Pins per Side n1 11 11 Lead Thickness c .004 .006 .008 0.09 0.15 0.20 Lead Width B .012 .015 .017 0.30 0.38 0.44 Mold Draft Angle Top α 51015 5 10 15 Mold Draft Angle Bottom β 51015 5 10 15 CH x 45 ° § Significant Characteristic |
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