LP38855 datasheet(2/20 Pages) TI

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TAB

GND

BIAS

OUT

GND

TAB

GND

BIAS

OUT

GND

LP38855

SNVS461D – OCTOBER 2006 – REVISED APRIL 2013

www.ti.com

Connection Diagrams

Top View

Figure 1. DDPAK/TO-263 Package

Figure 2. TO-220 Package

See Package Number KTT0005B

See Package Number NDH0005D

PIN DESCRIPTIONS

TO-220–5 and DDPAK/TO-263–5 Packages

Pin #

Pin Symbol

Pin Description

The device Enable pin.

The unregulated input voltage pin

GND

Ground

OUT

The regulated output voltage pin

BIAS

The supply for the internal control and reference circuitry

The TAB is a thermal connection that is physically attached to the backside of the

TAB

die, and is used as a thermal heat-sink connection. See the Application Information

section for details

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

Storage Temperature Range

−65°C to +150°C

Lead Temperature

Soldering, 5 seconds

260°C

ESD Rating

Human Body Model(3)

±2 kV

Power Dissipation(4)

Internally Limited

VIN Supply Voltage (Survival)

−0.3V to +6.0V

VBIAS Supply Voltage (Survival)

−0.3V to +6.0V

VEN Voltage (Survival)

−0.3V to +6.0V

VOUT Voltage (Survival)

−0.3V to +6.0V

IOUT Current (Survival)

Internally Limited

Junction Temperature

−40°C to +150°C

(1)

Absolute maximum ratings indicate limits beyond which damage to the component may occur. Operating ratings indicate conditions for

which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications, see Electrical

Characteristics. Specifications do not apply when operating the device outside of its rated operating conditions.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

The Human Body Model (HBM) is a 100 pF capacitor discharged through a 1.5k resistor into each pin. Test method is per JESD22-

A114. The HBM rating for device pin 1 (EN) is ±1.5 kV.

(4)

Device power dissipation must be de-rated based on device power dissipation (TD), ambient temperature (TA), and package junction to

ambient thermal resistance (

θJA). Additional heat-sinking may be required to ensure that the device junction temperature (TJ) does not

exceed the maximum operating rating. See the Application Information section for details.

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