LM2585 datasheet(2/32 Pages) TI

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LM2585

SNVS120F – APRIL 2000 – REVISED APRIL 2013

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

Input Voltage

−0.4V ≤ VIN ≤ 45V

Switch Voltage

−0.4V ≤ VSW ≤ 65V

Switch Current (3)

Internally Limited

Compensation Pin Voltage

−0.4V ≤ VCOMP ≤ 2.4V

Feedback Pin Voltage

−0.4V ≤ VFB ≤ 2V

Storage Temperature Range

−65°C to +150°C

Lead Temperature

(Soldering, 10 sec.)

260°C

Maximum Junction Temperature(4)

150°C

Power Dissipation (4)

Internally Limited

Minimum ESD Rating

(C = 100 pF, R = 1.5 k

Ω)

2 kV

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions the

device is intended to be functional, but device parameter specifications may not be specified under these conditions. For specifications

and test conditions see Electrical Characteristics (All Versions).

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

Note that switch current and output current are not identical in a step-up regulator. Output current cannot be internally limited when the

LM2585 is used as a step-up regulator. To prevent damage to the switch, the output current must be externally limited to 3A. However,

output current is internally limited when the LM2585 is used as a flyback regulator (See Application Hints for more information).

(4)

The junction temperature of the device (TJ) is a function of the ambient temperature (TA), the junction-to-ambient thermal resistance

(

θJA), and the power dissipation of the device (PD). A thermal shutdown will occur if the temperature exceeds the maximum junction

temperature of the device: PD × θJA + TA(MAX) ≥ TJ(MAX). For a safe thermal design, check that the maximum power dissipated by the

device is less than: PD ≤ [TJ(MAX) − TA(MAX))]/θJA. When calculating the maximum allowable power dissipation, derate the maximum

junction temperature—this ensures a margin of safety in the thermal design.

Operating Ratings

Supply Voltage

≤ VIN ≤ 40V

Output Switch Voltage

≤ VSW ≤ 60V

Output Switch Current

ISW ≤ 3.0A

Junction Temperature Range

−40°C ≤ TJ ≤ +125°C

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