LM2773TLSLASHNOPB datasheet(12/18 Pages) TI

12 / 18 page

LM2773

SNVS554A – JANUARY 2008 – REVISED MAY 2013

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Table 1. LM2773 Performance with Different Capacitor Configurations, 1.8V Mode (1)

CAPACITOR

TYPICAL

CONFIGURATION

OUTPUT

(VIN = 3.6V)

RIPPLE

CIN = 1µF,

COUT = 4.7µF,

10mV

C1, C2 = 1µF

CIN = 1µF,

COUT = 2.2µF,

16mV

C1, C2 = 1µF

CIN = 0.47µF,

COUT = 4.7µF,

12mV

C1, C2 = 1µF

CIN = 0.47µF,

COUT = 3.3µF,

12mV

C1, C2 = 1µF

CIN = 0.47µF,

COUT = 3.3µF,

13mV

C1, C2 = 0.47µF

(1)

Refer to the text in the Recommended Capacitor Configurations section for detailed information on the data in this table

Layout Guidelines

Proper board layout will help to ensure optimal performance of the LM2773 circuit. The following guidelines are

recommended:

•

Place capacitors as close to the LM2773 as possible, and preferably on the same side of the board as the IC.

•

Use short, wide traces to connect the external capacitors to the LM2773 to minimize trace resistance and

inductance.

•

Use a low resistance connection between ground and the GND pin of the LM2773. Using wide traces and/or

multiple vias to connect GND to a ground plane on the board is most advantageous.

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