TH02

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2.7. Soldering

TH02 devices are shipped, like most ICs, vacuum-packed with an enclosed desiccant to avoid any drift during

storage as well as to prevent any moisture-related issues during solder reflow. Devices should be soldered using

reflow and a “no clean” solder process, as a water or solvent rinse after soldering will affect accuracy. PCB Land

Pattern and Solder Mask Design” for the recommended card reflow profile.

The measured humidity value will generally shift slightly after solder reflow. This shift is accounted for when using

the linearization procedure given above. After soldering, TH02 should be allowed to equilibrate under controlled

RH conditions (room temperature, 45–55%RH) for at least 48 hours to reach rated accuracy. During soldering, it is

recommended that a protective cover of some kind be in place. Kapton®* polyimide tape is recommended as a

protective cover.

Alternatively, TH02s may be ordered with a factory fitted, solder-resistant protective cover which can be left in

place for the lifetime of the product, preventing liquids, dust or other contaminants from coming into contact with the

polymer sensor film. Ordering Guide” for a list of ordering part numbers that include the cover.

Hot air rework is not recommended. Soldering iron touch up is possible if flux is not needed and care is taken to

avoid excessive heating. If rework is required, remove the part by hot air and solder a new part by reflow. Use only

no-clean solder. Do not use solder resin or post-solder solvent cleanse.