LMZ14203H datasheet(23/31 Pages) TI

23 / 31 page

0.0

0.5

1.0

1.5

2.0

2.5

3.0

OUTPUT CURRENT (A)

VIN = 15V

VIN = 24V

VIN = 30V

VIN = 36V

VIN = 42V

Top View

VIN

COUT

VOUT

RENT

RON

CSS

GND

Thermal Vias

CIN

GND

RENB

CFF

RFBT

RFBB

GND Plane

EPAD

LMZ14203H

www.ti.com

SNVS692G – JANUARY 2011 – REVISED OCTOBER 2015

Layout Example (continued)

Figure 50. PCB Layout Guide

10.3 Power Dissipation and Board Thermal Requirements

For a design case of VIN = 24 V, VOUT = 12 V, IOUT = 3 A, TA (MAX) = 65°C , and TJUNCTION = 125°C, the device

must see a maximum junction-to-ambient thermal resistance of:

RθJA-MAX < (TJ-MAX - TA(MAX)) / PD

(24)

This RθJA-MAX will ensure that the junction temperature of the regulator does not exceed TJ-MAX in the particular

application ambient temperature.

To calculate the required RθJA-MAX we need to get an estimate for the power losses in the IC. The following graph

is taken form the Typical Characteristics section (Figure 16) and shows the power dissipation of the LMZ14203H

for VOUT = 12 V at 85°C TA.

Figure 51. Power Dissipation VOUT = 12V TA = 85°C

Submit Documentation Feedback

Product Folder Links: LMZ14203H

LMZ14203H 데이터시트(PDF) 23 Page - Texas Instruments

LMZ14203H 데이터시트(HTML) 23 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31

데이터시트 다운로드

링크 URL