| 전자부품 데이터시트 검색엔진 |
|
LC450029PKB 데이터시트(PDF) 23 Page - ON Semiconductor |
|
|
|||||||||||||||||||||||||||||
LC450029PKB 데이터시트(HTML) 23 Page - ON Semiconductor |
|
23 / 25 page ![]() LC450029PKB No.A1916-23/25 • PAD Locations (Bump Side View) • Chip dimensions (X, Y, S are based on the dicing center.) X=1.00mm Y=4.08mm S=4.08mm 2 Wafer thickness=400 μm (typ) • Au Bump dimensions (typ) Size Item PAD No. X [ μm] Y [ μm] S [ μm 2] 1 to 59 108 27 2916 Bump Size 60 to 106 68 42 2856 10 to 58 50 - Min. Bump Pitch 1 to 9, 59 to 106 - - 10 to 58, 66 to 71, 73 to 90, 93 to 105 23 - Min. Bump Clearance 1 to 9, 59 to 65, 72, 91 to 92, 106 - - Bump Height All pads 17 - • Alignment marks (1) A-Type (2) B-Type (3) C-Type X Y (0, 0) Alignment Mark #1 (A-Type) Alignment Mark #2 (B-Type) Alignment Mark #3 (C-Type) MODEL NAME 10 30 60 50 80 50 80 20 Unit: μm |
|
|
링크 URL |
| ALLDATASHEET 가 귀하에 도움이 되셨나요? [ DONATE ] |
Alldatasheet는? | 광고문의 | 운영자에게 연락하기 | 개인정보취급방침 | 링크 투 데이터시트 | 링크교환 | 제조사별 검색 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |