LifecyclePhase:

Revision

: 2

Expired Period: Forever

Release Date:2013-06-04 10:06:47.0

DATASHEET

5.0mm Infrared LED

HIR7373C

7

Copyright © 2010, Everlight All Rights Reserved. Release Date : Mar.29.2013. Issue No:DIR-0000949

www.everlight.com

Prehead

laminar wave

Fluxing

1.

Lead Forming



During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb.



Lead forming should be done before soldering.



Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s characteristics or it

may break the LEDs.



Cut the LED lead frames at room temperature. Cutting the lead frames at high temperatures may cause failure of the LEDs.



When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED. If the LEDs

are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs.

2.

Storage



The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Everlight and the storage life limits

are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with a

nitrogen atmosphere and moisture absorbent material.



Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can

occur.

3.

Soldering



Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to epoxy bulb,

and soldering beyond the base of the tie bar is recommended.



Recommended soldering conditions:

Hand Soldering

DIP Soldering

Temp. at tip of iron

300℃ Max. (30W Max.)

Preheat temp.

100℃ Max. (60 sec Max.)

Soldering time

3 sec Max.

Bath temp. & time

260 Max., 5 sec Max

Distance

3mm Min.(From solder

joint to epoxy bulb)

Distance

3mm Min. (From solder

joint to epoxy bulb)



Recommended soldering profile



Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly when soldering.



Dip and hand soldering should not be done more than one time