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LX7001CDM 데이터시트(PDF) 2 Page - Microsemi Corporation |
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LX7001CDM 데이터시트(HTML) 2 Page - Microsemi Corporation |
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2 / 9 page ![]() TRANSIENT IMMUNE UNDERVOLTAGE SENSING CIRCUIT LX7001 PRODUCT DA T ABOOK 1996/1997 Copyright © 1999 Rev. 1.2 6/99 2 P RODUCTION D AT A S HEET ABSOLUTE MAXIMUM RA TINGS (Note 1) Input Supply Voltage (V IN) ............................................................................... -1V to 12V RESET Output Voltage (V OUT) .......................................................................... -1V to 12V Output Sink Current (I OL) ............................................................ Internally Limited (mA) Clamp Diode Forward Current (I F), Pin 1 to pin 2 ............................................... 100mA Operating Junction Temperature Ceramic (Y - Package) .......................................................................................... 150°C Plastic (DM, LP - Packages) .................................................................................. 150°C Storage Temperature Range ...................................................................... -65°C to 150°C Lead Temperature (Soldering, 10 seconds) ............................................................. 300°C PACKAGE PIN OUTS RESET V IN N.C. GROUND N.C. N.C. N.C. N.C. 1 8 2 7 3 6 4 5 DM PACKAGE (Top View) DM PACKAGE: THERMAL RESISTANCE-JUNCTION TO AMBIENT, θθθθθ JA 165°C/W LP PACKAGE: THERMAL RESISTANCE-JUNCTION TO AMBIENT, θθθθθ JA 156°C/W Y PACKAGE: THERMAL RESISTANCE-JUNCTION TO AMBIENT, θθθθθ JA 130°C/W Junction Temperature Calculation: T J = TA + (PD x θJA). The θ JA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow THERMAL DATA Note 1. Values beyond which damage may occur. All voltages are specified with respect to ground, and all currents are positive into the specified terminal. 3. GROUND 2. V IN 1. RESET LP PACKAGE (Top View) Y PACKAGE (Top View) RESET V IN N.C. GROUND N.C. N.C. N.C. N.C. 18 27 36 45 |
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