MSFM

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Vishay Electro-Films

Revision: 26-Jan-15

2

Document Number: 61096

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

DIMENSIONS in inches

POWER DERATING CURVE

MECHANICAL SPECIFICATIONS

PARAMETER

VALUE

Chip Size

0.015" x 0.015" ± 0.002" (0.381 mm x 0.381 mm ± 0.05 mm)

Chip Thickness

0.010" ± 0.002" (0.254 mm ± 0.05 mm)

Chip Substrate Material

Oxidized silicon, 10 kÅ minimum oxide

Resistor Material

Tantalum nitride, self-passivating

Bonding Pad Size

0.004" x 0.004" (0.1 mm x 0.1 mm)

Number of Pads

2

Pad Material

10 kÅ minimum aluminum (Au optional)

Backing

None, lapped silicon

GLOBAL PART NUMBER INFORMATION

Global Part Number: MSFM10001FKANHWS

Global Part Number Description: MSFM 10K 1 %, 100 ppm/°C, Al, no back metal, class H, WS

MODEL

RESISTANCE

RESISTANCE

MULTIPLIER

CODE

TOLERANCE

CODE

(%)

TCR

(ppm/°C)

TERMINATION

BACK

METAL

VISUAL

CLASS

PACKAGING

CODE

MSFM

15 x 15

size

Ta2N on

silicon

First 4

digits are

significant

figures of

resistance

C = 0.001

B = 0.01

A = 0.1

0 = 1

1 = 10

2 = 100

3 = 1000

B = 0.1

C = 0.25

D = 0.5

F = 1.0

G = 2.0

H = 2.5

J = 5.0

K = 10.0

E = ± 25

C = ± 50

K = ± 100

M = ± 250

G = Au

A = Al

G = Au

N = None

H = Class H

K = Class K

WS =

Waffle pack

100 min., 1 mult

0.004

0.0015

(70, 125)

Temperature (°C)

- 100

- 50

0

50

100

150

200

120

140

100

80

60

40

20

0

0

1

F

ANH

K

1

WS

M

SF

0

M

0