Ver: 0.6

Dec 20, 2012

TEL: 886-3-5788833

http://www.gmt.com.tw

1

G2001

Global Mixed-mode Technology

6+1CH serial input motor driver IC for DSC

Features

Build-in two micro-steps drive mode is possible

from 2-2 phase stepper drive to maximum 256

resolution micro-steps.

Built in 2 full-swing/constant voltage/constant

current drivers switched by serial control with

brake function

Low on-resistance (1.2

Ω, sum of on-resistance of

upside and bottom side)

Build-in thermal shutdown (TSD, 150°C)

All power supply systems (VCC, VM12, VM34,

VM5, VM6) can be set up with an independent

power supply

Power save mode corresponds by serial control

setup

PI (photo interrupter drive) 3 channel built-in.

Small 40TQFN (5

×5mm) is adopted

Build-in POR (power on reset).

Applications

Stepping motor driver/ DC motor driver motor

driver for DSC

General Description

G2001 is a 6+1-channel H-Bridge motor drivers IC for the

digital camera and so on. It has two micro-stepping drivers,

two full-swing/constant voltage/constant current drivers.

G2001 can be operated in serial control mode or partial

exterior control mode. When operating in partial exterior

control mode, the mode of each CH is fixed by initial

serial control setting. When operating in serial control

mode, the mode of each driver can be setting by serial

control.

Ordering Information

ORDER

NUMBER

MARKING

TEMP.

RANGE

PACKAGE

(Green)

G2001RG1U

2001

-20°C to +85°C TQFN5X5-40

Note: RG: TQFN5X5-40

1: Bonding Code

U: Tape & Reel

Pin Configurations

CH12:Micro_stepping

CH34:Micro_stepping

CH5: CC/CV/FS

CH6: CC/CV/FS

PI3

EXT1 / ST1

OUT2B

OUT2A

VM12

OUT1B

PGND12

OUT1A

GND

1

2

3

4

5

6

7

8

9

10

IN4

SLD

SCLK

SDAT

VM5

OUT5A

RNF5

OUT5B

G2001 TQFN5X5-40

Thermal

Pad

30

29

28

27

26

25

24

23

22

21

PGND12

IN3

Note: Thermal Pad must connect to the Ground for excellent power dissipation.

MOB1 / SDO

PI3

EXT1 / ST1

OUT2B

OUT2A

VM12

OUT1B

PGND12

OUT1A

GND

1

2

3

4

5

6

7

8

9

10

IN4

SLD

SCLK

SDAT

VM5

OUT5A

RNF5

OUT5B

G2001 TQFN5X5-40

Thermal

Pad

30

29

28

27

26

25

24

23

22

21

PGND12

IN3

Note: Thermal Pad must connect to the Ground for excellent power dissipation.

MOB1 / SDO