TMP007

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SBOS685C – APRIL 2014 – REVISED JULY 2015

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

7

V

Voltage

ADR1

V

Input voltage

All other pins

–0.5

+7

V

Current

Input current, any pin

10

mA

Operating range

–40

+125

°C

Temperature

125

°C

–65

+125

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input voltage rating applies to all TMP007 input voltages.

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic

±500

V

discharge

Machine model

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

2.5

3.3

5.5

V

Operating temperature range

–40

+125

°C

125

°C

°C

(1)

Object temperature is application dependent.

6.4 Thermal Information

TMP007

YZF (DSBGA)

UNIT

8 PINS

Junction-to-ambient thermal resistance

115.3

°C/W

Junction-to-case (top) thermal resistance

0.4

°C/W

Junction-to-board thermal resistance

14.3

°C/W

Junction-to-top characterization parameter

3.8

°C/W

Junction-to-board characterization parameter

14.1

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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