TMP100, TMP101

SBOS231I – JANUARY 2002 – REVISED NOVEMBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Power supply, V+

7.5

V

–0.5

7.5

V

Operating temperature

–55

125

°C

150

°C

–60

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input voltage rating applies to all TMP100 and TMP101 input voltages.

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

2.7

5.5

V

–55

125

°C

6.4 Thermal Information

TMP100, TMP101

DBV (SOT-23)

UNIT

6 PINS

Junction-to-ambient thermal resistance

182.9

°C/W

Junction-to-case (top) thermal resistance

115

°C/W

Junction-to-board thermal resistance

30.2

°C/W

Junction-to-top characterization parameter

17.1

°C/W

Junction-to-board characterization parameter

29.7

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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