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MTSF2P02HDR2 데이터시트(PDF) 7 Page - ON Semiconductor |
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MTSF2P02HDR2 데이터시트(HTML) 7 Page - ON Semiconductor |
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7 / 12 page ![]() MTSF2P02HD http://onsemi.com 7 t, TIME Figure 13. Reverse Recovery Time (trr) di/dt = 300 A/ µs Standard Cell Density High Cell Density tb trr ta trr SAFE OPERATING AREA The Forward Biased Safe Operating Area curve (Figure 14) defines the maximum simultaneous drain−to−source voltage and drain current that a transistor can handle safely when it is forward biased. Curves are based upon maximum peak junction temperature and a case temperature (TC) of 25 °C. Peak repetitive pulsed power limits are determined by using the thermal response data in conjunction with the procedures discussed in AN569, “Transient Thermal Resistance − General Data and Its Use.” Switching between the off−state and the on−state may traverse any load line provided neither rated peak current (IDM) nor rated voltage (VDSS) is exceeded, and that the transition time (tr, tf) does not exceed 10 µs. In addition the total power averaged over a complete switching cycle must not exceed (TJ(MAX) − TC)/(RθJC). Figure 14. Maximum Rated Forward Biased Safe Operating Area 0.1 VDS, DRAIN−TO−SOURCE VOLTAGE (VOLTS) 1 10 RDS(on) LIMIT THERMAL LIMIT PACKAGE LIMIT 0.01 VGS = 8 V SINGLE PULSE TC = 25°C 10 0.1 dc 10 ms 1 100 100 1 ms 100 µs |
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