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Material Content Data Sheet

Sales Product Name

IPL65R725CFD

Issued

29. August 2013

MA#

MA001068898

Package

PG-VSON-4-1

Weight*

187.25 mg

Construction Element

Material Group

Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip

inorganic material

silicon

7440-21-3

3.294

1.76

1.76

17591

17591

leadframe

inorganic material

phosphorus

7723-14-0

0.020

0.01

108

non noble metal

zinc

7440-66-6

0.081

0.04

432

non noble metal

iron

7439-89-6

1.619

0.86

8644

non noble metal

copper

7440-50-8

65.718

35.10

36.01

350968

360152

wire

non noble metal

copper

7440-50-8

0.684

0.37

0.37

3651

3651

encapsulation

organic material

carbon black

1333-86-4

0.220

0.12

1177

plastics

epoxy resin

-

11.347

6.06

60598

inorganic material

silicondioxide

60676-86-0

98.596

52.66

58.84

526553

588328

leadfinish

non noble metal

tin

7440-31-5

2.397

1.28

1.28

12804

12804

plating

noble metal

silver

7440-22-4

0.252

0.13

0.13

1346

1346

solder

non noble metal

tin

7440-31-5

0.060

0.03

323

noble metal

silver

7440-22-4

0.075

0.04

403

non noble metal

lead

7439-92-1

2.884

1.54

1.61

15402

16128

*deviation

< 10%

Sum in total:

100,00

1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

Company

Infineon Technologies AG

Address

81726 München

Internet

www.infineon.com