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MIS2DH 데이터시트(PDF) 47 Page - STMicroelectronics |
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MIS2DH 데이터시트(HTML) 47 Page - STMicroelectronics |
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47 / 49 page ![]() DocID027506 Rev 2 47/49 MIS2DH Package information 49 8 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 8.1 LGA package information Figure 12. LGA-12 package outline and mechanical data Land Grid Array Package Outline and mechanical data LGA-12 (2.0x2.0x1 mm) Dimensions (mm) Ref. Min. Typ. Max. A1 1 A2 0.785 A3 0.200 D1 1.850 2.000 2.150 E1 1.850 2.000 2.150 L1 1.500 N1 0.500 T1 0.275 T2 0.250 P2 0.075 r 45° M 0.100 K 0.050 8365767_A |
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