ams Datasheet

Page 5

[v1-06] 2015-Apr-07

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AS1111 − Absolute Maximum Ratings

Stresses beyond those listed under Absolute Maximum Ratings

may cause permanent damage to the device. These are stress

ratings only. Functional operation of the device at these or any

other conditions beyond those indicated under Electrical

Characteristics is not implied. Exposure to absolute maximum

rating conditions for extended periods may affect device

reliability.

Figure 5:

Absolute Maximum Ratings

Note(s) and/or Footnote(s):

1. Junction-to-ambient thermal resistance is very dependent on application and board-layout. In situations where high maximum

power dissipation exists, special attention must be paid to thermal dissipation during board design.

2. The reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD-020 “Moisture/Reflow

Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices.”

Symbol

Parameter

Min

Max

Units

Comments

Electrical Parameters

Supply Voltage to

Ground

5V pins

-0.3

5.0

V

Applicable for pins:

I1, I2, I3, I4, I1/I2, I3/I4, CTRL, EN

Input Current

(latch-up immunity)

-100

100

mA

Norm: JEDEC JESD78

Electrostatic Discharge

Electrostatic Discharge

HBM

±2

kV

Norm: JEDEC JESD22-A114F

Temperature Ranges and Storage Conditions

Operating Temperature

-40

85

°C

(1)

Junction to Ambient

Thermal Resistance

60

°C/W

MLPD

95

°C/W

WL-CSP

Junction Temperature

125

°C

WL-CSP

Storage Temperature

Range

-55

125

°C

Package Body

Temperature

260

°C

Norm: IPC/JEDEC J-STD-020 (2)

Relative Humidity

non-condensing

585

%

MSL

Moisture Sensitivity

Level (WL-CSP & MLPD)

1

Represents an unlimited floor life

time

Absolute Maximum Ratings