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AS8202B

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only. Functional operation of the

device at these or any other conditions beyond those indicated in Electrical Characteristics on page 7 is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Symbol

Parameter

Min

Max

Unit

Notes

Electrical Parameters

DC Supply voltage

-0.3

5.0

V

Input voltage

-0.3

V

any pin

Input current

-100

100

mA

Electrostatic Discharge

ESD

Electrostatic discharge

1000

V

HBM: 1KV Mil.std.883, Method 3015.7

Temperature Ranges and Storage Conditions

Storage temperature

-55

+150

ºC

Package body temperature

260

ºC

The reflow peak soldering temperature (body

temperature) specified is in accordance with

IPC/JEDEC J-STD-020 “Moisture/Reflow

Sensitivity Classification for Non-Hermetic

Solid State Surface Mount Devices”.

The lead finish for Pb-free leaded packages is

matte tin (100% Sn).

H

Humidity non-condensing

5

85

%

MSL

Moisture sensitivity level

3

Represents a maximum floor life time of 168h