TMP103

SBOS545B – FEBRUARY 2011 – REVISED JANUARY 2016

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Table of Contents

7.4

Device Functional Modes........................................ 11

1

Features .................................................................. 1

7.5

Programming........................................................... 11

2

Applications ........................................................... 1

7.6

Register Maps ......................................................... 16

3

Description ............................................................. 1

8

Application and Implementation ........................ 19

4

Revision History..................................................... 2

8.1

Application Information............................................ 19

5

Pin Configurations and Functions ....................... 3

8.2

Typical Application ................................................. 19

6

Specifications......................................................... 3

9

Power Supply Recommendations ...................... 21

6.1

Absolute Maximum Ratings ...................................... 3

10

Layout................................................................... 21

6.2

ESD Ratings.............................................................. 3

10.1

Layout Guidelines ................................................. 21

6.3

Recommended Operating Conditions ....................... 3

10.2

Layout Example .................................................... 21

6.4

Thermal Information .................................................. 4

11

Device and Documentation Support ................. 22

6.5

Electrical Characteristics........................................... 4

11.1

Community Resources.......................................... 22

6.6

Timing Requirements ................................................ 5

11.2

Trademarks ........................................................... 22

6.7

Typical Characteristics .............................................. 9

11.3

Electrostatic Discharge Caution ............................ 22

7

Detailed Description ............................................ 10

11.4

Glossary ................................................................ 22

7.1

Overview ................................................................. 10

12

Mechanical, Packaging, and Orderable

7.2

Functional Block Diagram ....................................... 10

Information ........................................................... 22

7.3

Feature Description................................................. 11

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision A (March 2011) to Revision B

Page

•

Added ESD Ratings table, Feature Description section, Device Functional Modes section, Application and

Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation

Support section, and Mechanical, Packaging, and Orderable Information section ............................................................... 1

•

Added SSDs, Servers, Telecom, Set Top Boxes, Low Power Environmental, and Sensors to Applications section............ 1

Changes from Original (February 2011) to Revision A

Page

•

Changed Package-Lead from WCSP-4 to DSBGA-4 in Device Information table ................................................................ 1

2

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