USB2251 datasheet(37/43 Pages) MICROCHIP

37 / 43 page

USB2250/50i/51/51i

DS00002005A-page 37

 2009 - 2015 Microchip Technology Inc.

Note 9-5

Output leakage is measured with the current pins in high impedance.

Note 9-6

See The USB 2.0 Specification, Chapter 7, for USB DC electrical characteristics

Note 9-7

RBIAS is a 3.3 V tolerant analog pin.

Note 9-8

Output current range is controlled by program software, software disables FET during short circuit

condition.

9.4

Capacitance

TA = 25°C; fc = 1 MHz; VDD, VDDP = 1.8 V

9.5

Package Thermal Specification

Note 9-9

Thermal parameters are measured or estimated for devices with the exposed pad soldered to thermal

vias in a multilayer 2S2P PCB per JESD51. Thermal resistance is measured from the die to the

ambient air.

Supply Current Active

Full Speed

High Speed

ICC

110

135

140

165

VDD33 = 3.3 V

Supply Current Suspend

ICSBY

350

750

AV

DD33, V = 3.3 V

Industrial Temperature Suspend

ICSBYI

350

950

A

Parameter

Symbol

Limits

Unit

Test Condition

MIN

TYP

MAX

Clock Input Capacitance

CXTAL

All pins (except USB pins and

pins under test) are tied to AC

ground.

Input Capacitance

CIN

Output Capacitance

COUT

TABLE 9-1:

128-PIN VTQFP PACKAGE THERMAL PARAMETERS

Parameter

Velocity

(meters/sec)

Symbol

Value

Unit

Thermal Resistance



°C/W

148

245

Junction-to-Top-of-Package



°C/W

118

218

Parameter

Symbol

MIN

TYP

MAX

Units

Comments

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