| 전자부품 데이터시트 검색엔진 |
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SP1ML-915 데이터시트(PDF) 13 Page - STMicroelectronics |
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SP1ML-915 데이터시트(HTML) 13 Page - STMicroelectronics |
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13 / 27 page ![]() DocID026906 Rev 4 13/27 SP1ML Hardware design 27 2.4 Recommended footprint Figure 5. Recommended footprint 2.5 Module reflow installation The SP1ML is a surface mount module supplied on a 16-pin, 4-layer PCB. The final assembly recommended reflow profile is indicated below, based on IPC/JEDEC JSTD- 020C, July 2004 recommendations. Table 8. Soldering profile Profile feature Lead-free assembly Average ramp-up rate (TSMAX to TP) 3 °C/sec max Preheat: – Temperature min. (TS min.) – Temperature max. (TS max.) – Time (ts min. to ts max.)(ts) 150 °C 200 °C 60-100 sec |
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