Package mechanical data

DLPF-GP-01D3

6/9

DocID026812 Rev 1

Figure 9. Layout recommendations

No extra components required thanks to DLPF-GP-01D3.

Dimensions (distances) from center pad to center pad (filter GP chip) shall be respected as

much as possible in order to avoid any deviation in performances.

Figure 10. Footprint - non solder mask

defined

Figure 11. Footprint - solder mask defined

Copper pad diameter:

220 µm recommended

180 µm minimum

260 µm maximum

Solder mask opening:

320 µm recommended

300 µm minimum

340 µm maximum

Solder stencil opening:

220 µm recommended

Line to connect copper pad on solder mask opening

shopuld be smaller than copper pad diameter

Solder mask opening :

220 µm recommended

180 µm minimum

260 µm maximum

Copper pad diameter :

320 µm recommended

300 µm minimum

Solder stencil opening :

220 µm recommended