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M24M02-DR 데이터시트(PDF) 37 Page - STMicroelectronics |
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M24M02-DR 데이터시트(HTML) 37 Page - STMicroelectronics |
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37 / 38 page ![]() DocID18204 Rev 8 37/38 M24M02-DR Revision history 37 23-May-2014 7 removed note on page 7, Updated Table 3: Device select code, updated section numbering for Section 5.2.4 and Section 5.2.5, updated note 1 on Table 11: Memory cell data retention, updated Figure 18: WLCSP- 8-bump, 3.556 x 2.011 mm, wafer level chip scale package recommended footprint. 27-Jul-2015 8 Updated: – Figure 3 with note 1. – Table 2 – Section 9.1: SO8N package information and Section 9.2: WLCSP package information Table 18. Document revision history (continued) Date Revision Changes |
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