349

Reference for Manual Soldering

Example of Reflow Soldering Condition

Reference for Dip Soldering

300

200

100

A

B

C

Time (s)

G max.

F max.

H max.

E max.

Room

temperature

Pre-heating

D

Series

Tip temperature

Soldering time

No. of solders

RK09L, RK097

350℃ max.

3s max.

1 time

RK203

300℃ max.

3s max.

1 time

RK119

350±10℃

3 　 s

1 time

RK271

350℃ max.

5s max.

1 time

RK501

350±10℃

5 　 s

1 time

RK163

350℃ max.

5s max.

1 time

RK168

Potentiometer

terminal

300℃ max.

3s max.

1 time

Motor terminal

350℃ max.

2s max.

1 time

Series

Preheating

Dip soldering

No. of solders

Soldering surface

temperature

Heating time

Soldering

temperature

Soldering time

RK09L, RK097, RK203

100℃ max.

2 min. max.

260±5℃

5±1s

2 time max.

RK501

120±10℃

2 min. max.

260±5℃

5±1s

2 time

+1

0

Series

A

B

C

D

E

F

G

H

No. of reflows

RK119

260℃

230℃

180℃

150℃

2 min.

3s

40s

4 min.

2 time max.

1. When using an infrared reflow oven, solder may sometimes not be applied. Be sure to use a hot air reflow oven or at type that uses

infrared rays in combination with hot air.

2. The temperatures given above are the maximum temperatures at the terminals of the potentiometer when

employing a hot air reflow method. The temperature of the PC board and the surface temperature of the

potentiometer may vary greatly depending on the PC board material, its size and thickness. Ensure that the surface

temperature of the potentiometer does not rise to 250℃ or greater.

3. Conditions vary to some extent depending on the type of reflow bath used. Be sure to give due consideration to this prior to use.

Notes

Temperature profile

+1

0

Metal Shaft Potentiometers / Soldering Conditions