DocID027851 Rev 5

13/23

SPBTLE-RF

Hardware design

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5

Hardware design

SPBTLE-RF module supports SPI hardware interfaces.

Note:

- All unused pins should be left floating; do not ground.

- All GND pins must be well grounded.

- The area around the module should be free of any ground planes, power planes, trace

routings, or metal for 6 mm from the module antenna position, in all directions.

- Traces should not be routed underneath the module.

5.1

Reflow soldering

on a 11 pin, 4-layer PCB. The final assembly recommended reflow profiles are indicated

here below.

Soldering phase has to be executed with care: in order to avoid undesired melting

phenomenon, particular attention has to be taken on the set up of the peak temperature.

Here following some suggestions for the temperature profile based on following

recommendations.

Table 6. Soldering

Profile feature

PB-free assembly

3°C/ sec max

Preheat

150 °C

200 °C

60-100 sec

Time maintained above:

217 °C

60-70 sec

240 + 0 °C

10-20 sec

Ramp down rate

6 °C/sec

Time from 25 °C to peak temperature

8 minutes max