461

I max.

H max.

300

200

100

Room

temperature

Pre-heating

E max.

Time（s）

A

B

C

D

F max.

G max.

Notes

1. The above temperature shall be measured on the mounting surface of a PC board. There are cases where the PC

board’s temperature greatly differs from that of the switch, depending on the material, size thickness of PC boards

and others. The above-stated conditions shall also apply to switch surface temperatures.

2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is

highly recommended.

Soldering surface temperature

Soldering temperature

Heating time

Soldering time

No. of solders

RKJXS

RKJXL

RKJXT1F, RKJXM

RKJXT1F, RKJXM, RKJXL,

SLLB, SLLB5, SRBE, SKRV, SKRH

Series

Series

350±5℃

3s max.

1 time

100℃ max.

260±5℃

2 min. max.

5±1s

2 time max.

350±10℃

3 　 s

2 time max.

120℃ max.

260℃ max.

70s max.

6s max.

2 time max.

Tip temperature

Soldering time

No. of solders

Preheating

Dip soldering

Reference for Dip Soldering

Example of Reflow Soldering Condition

Reference for Manual Soldering

SKRV, SKRH, SLLB, SRBE

SLLB5

RKJXS

Series

260℃

230℃

150℃

150℃

2 min.

ー

10s

40s

4 min.

1 time

250℃

230℃

150℃

150℃

ー

2 min.

ー

30s

ー

1 time

260℃

230℃

180℃

150℃

2 min.

ー

ー

40s

ー

1 time

A

B

C

D

E

F

G

H

I

No. of reflows

Temperature profile

＋1

−0

Switch Type / Soldering Conditions