138

138

Soldering time

SPEH

Series

Series

Example of Reflow Soldering Condition

1. Heating method: Double heating method with infrared heater.

2. Temperature measurement: Thermocouple φ 0.1 to 0.2 CA (K) or CC (T) at soldering portion (copper foil surface).

A heat resisting tape should be used for fixed measurement.

3. Temperature profile

300

200

100

A max.

B

E

D

Time (s)

C

Pre-heating

F max.

Room

temperature

1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's

　 temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc.

The above-stated conditions shall also apply to switch surface temperatures.

2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended.

Notes

260

Series（Reflow type）

230

40

180

150

120

SPEG

SPEJ

SPEF

A（℃）

3s max.

B（℃）

C（s）

D（℃）

E（℃）

F（s）

10±1s

Soldering temperature Duration of immersion

Preheating temperature

Preheating time

SPPJ2, SPPH1, SPED2, SPED4, SPEF

SPUJ, SPPH2, SPPH4

SPUN

SPPJ3

100℃ max.

60s max.

260±5℃

5±1s

100℃ max.

60s max.

260±5℃

10±1s

—

260±5℃

5±1s

—

260±5℃

Items

Dip soldering

Reference for Dip Soldering

(For PC board terminal types)

300±10℃

SPUJ

3+1/0s

350℃ max.

SPEH, SPPH2

SPEG, SPEF

SPEJ

SPED2, SPED4

SPPJ3, SPPJ2, SPUN, SPPH4, SPPH1

350±10℃

3+1/0s

350±10℃

3±0.5s

350±10℃

4s max.

350±5℃

3s max.

3s max.

Soldering temperature

Reference for Hand Soldering

For PC board　端子タイプに適用

Push Switches Soldering Conditions