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Example of Reflow Soldering Condition

1. Heating method: Double heating method with infrared heater.

2. Temperature measurement: Thermocouple φ0.1 to 0.2 CA（K）or CC（T）at soldering portion（copper foil surface）.

　 A heat resisting tape should be used for fixed measurement.

3. Temperature profile

300

200

100

A max.

B

E

D

Time (s)

C

Pre-heating

F max.

Room

temperature

SPPB

260

230

40

35

40

180

150

120

SPPW8

SPVE

250

SSCQ

250

SPVN

SPVL

SPVM

SPVS

SPVT

SSCM

SPVR

Series（Reflow type）

A（℃）3s max.

B（℃）

C（s）

D（℃）

E（℃）

F（s）

SPVQC

1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's

temperature greatly differs from that of the switch, surface depending on the PC board's material, size, thickness, etc.

The above-stated conditions shall also apply to switch surface temperatures.

2. Soldering conditions differ depending on reflow soldering machines.

Prior verification of soldering condition is highly recommended.

Notes

Detector Switches Soldering Conditions

Reference for Hand Soldering

SPVS, SPVN, SPVT, SPVM, SPVR,

SPVE, SPPW8,SSCQ, SSCM,

SPVL, SSCT, SPVQC

SPVQ1, SPVQ3, SPVQ6, SPVQ7,

SPVQ8, SPVQ9, SSCN, SPVQA

SPPB（Reflow）

SSCF, SPPB（For Lead, Dip）

Soldering

temperature

350±5℃

300±5℃

300±10℃

350±10℃

Soldering time

3s max.

5s max.

3 +1 / 0s

3 +1 / 0s

Series

Reference for Dip Soldering

(For PC board terminal types)

SSCT, SPVQ1, SPVQ3,

SPVQ6, SPVQ7, SPVQ8,

SPVQ9, SPVQA

SSCF

SPPW8, SPPB

Items

Preheating

temperature

Soldering

temperature

Preheating

time

Duration of

immersion

Dip soldering

260±5℃

100±10℃

5±1s

60s max.

260±5℃

ー

5±1s

255±5℃

100 ℃

max.

5±1s

60s max.

Series