UT54ACTS20E datasheet(2/9 Pages) AEROFLEX

2 / 9 page

36-00-04-003

Ver. 1.0.0

Aeroflex Microelectronics Solutions - HiRel

OPERATIONAL ENVIRONMENT 1

Notes:

1. Logic will not latchup during radiation exposure within the limits defined in the table.

2. Device storage elements are immune to SEU affects.

ABSOLUTE MAXIMUM RATINGS

Note:

1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, functional operation of the device at these

or any other conditions beyond limits indicated in the operational sections is not recommended. Exposure to absolute maximum rating conditions for extended periods

may affect device reliability.

2. Per MIL-STD-883, method 1012.1, Section 3.4.1, PD = (Tj(max) - Tc(max) ) / Θjc

RECOMMENDED OPERATING CONDITIONS

PARAMETER

LIMIT

UNITS

Total Dose

1.0E6

rads(Si)

SEU Threshold 2

108

MeV-cm2/mg

SEL Threshold

120

MeV-cm2/mg

Neutron Fluence

1.0E14

n/cm2

SYMBOL

PARAMETER

LIMIT

UNITS

VDD

Supply voltage

-0.3 to 7.0

VI/O

Voltage any pin

-0.3 to VDD + 0.3

TSTG

Storage Temperature range

-65 to +150

°C

Maximum junction temperature

+175

°C

TLS

Lead temperature (soldering 5 seconds)

+300

°C

Thermal resistance junction to case

15.5

°C/W

DC input current

±10

Maximum package power dissipation

permitted @ Tc = +125oC

3.2

SYMBOL

PARAMETER

LIMIT

UNITS

VDD

Supply voltage

3.0 to 5.5

VIN

Input voltage any pin

0 to VDD

Temperature range

-55 to +125

°C

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