Data Sheet

ADG5404F

Rev. B | Page 13 of 30

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

Figure 2. TSSOP Pin Configuration

Figure 3. LFCSP Pin Configuration

Table 7. Pin Function Descriptions

Pin No.

Mnemonic

Description

TSSOP

LFCSP

1

15

A0/F01

Logic Control Input (A0).

Decoder for the SF Pin (F0).

2

16

EN

Active High Digital Input. When this pin is low, the device is disabled and all switches are off.

When this pin is high, the Ax logic control inputs determine the on switches.

3

1

Most Negative Power Supply Potential.

4

3

S1

Overvoltage Protected Source Terminal 1. This pin can be an input or an output.

5

4

S2

Overvoltage Protected Source Terminal 2. This pin can be an input or an output.

6

6

D

Drain Terminal. This pin can be an input or an output.

7

5

DR

during an overvoltage fault condition. The default condition of the drain is open circuit when

8

7

SF

Specific Fault Digital Output. This pin has a high output when the device is in normal operation

and a low output when a fault condition is detected on a specific pin, depending on the state

of A0/F0 and A1/F1 (see Table 9).

9

8

FF

Fault Flag Digital Output. This pin has a high output when the device is in normal operation

and a low output when a fault condition occurs on any of the Sx inputs.

10

9

S4

Overvoltage Protected Source Terminal 4. This pin can be an input or an output.

11

10

S3

Overvoltage Protected Source Terminal 3. This pin can be an input or an output.

12

11

Most Positive Power Supply Potential.

13

12

GND

Ground (0 V) Reference.

14

14

Logic Control Input (A1).

Decoder for the SF Pin (F1).

2, 13

NIC

Not internally connected

17

EP

The exposed pad is connected internally. For increased reliability of the solder joints and

1

Throughout the data sheet, dual function pin names are referenced by the relevant function where applicable.

2

N/A means not applicable.

1

2

3

4

5

6

7

EN

S1

DR

D

S2

A0/F0

14

13

12

11

10

9

8

GND

S3

SF

FF

S4

A1/F1

ADG5404F

TOP VIEW

(Not to Scale)

12

11

10

1

3

4

9

2

NOTES

1. NIC = NOT INTERNALLY CONNECTED.

2. THE EXPOSED PAD IS CONNECTED INTERNALLY. FOR INCREASED

RELIABILITY OF THE SOLDER JOINTS AND MAXIMUM THERMAL

CAPABILITY, IT IS RECOMMENDED THAT THE PAD BE SOLDERED

NIC

S1

S2

GND

S3

S4

ADG5404F

TOP VIEW

(Not to Scale)